Spire Lunar IV SP588 1U Rackmount Server - High Performance 1U Server for Data Centers, Cloud Computing & Enterprise IT Solutions

Product Description

Spire Lunar IV - SP588-1U

Spire is proud to release the newest in 1U server cooling solution, Part Number: SP588-1U micro-processor passive cooler for the 775 socket type.

After a series of great success among server builders, Spire has delivered with its newest of higher performance 1U solutions Spire is introducing the all new 0dBA All copper heat-sink design, especially developed for the 1U Server rack-mounts.

The unique 50 pcs skyved all copper thin-fin design enable swift thermal transfer from heat source to surrounding colder air. This design work most effectively with indirect air-flow guided thru the thin-fins of the Positivo. (please refer to air-flow graph below)

Main Features:

* Pure copper heat-sink
* Low profile - 1U (rack-mount application only)
* Passive heat-sink 0dBA
* Most effective with indirect air-ducting

Product Includes :
* Multilanguage Owners Manual *Screw Installation clip * Stars-420 Thermal compound

Technical Specs:

Socket 775 Cooling kit
Dimensions Heat sink : 87×83×27 mm (l × w × h) 

Rated power N.A W
Noise level 0 dBA
Air flow N.A
Current N.A A
Features All Copper Heatsink,1U Rackmount
Connector N.A.
Application Intel : Celeron D ~ 3.2 GHz
Celeron D ~ 2.93 GHz (340J)
Intel : Core 2 Duo ~ 3 GHz (775 Dual-core)
Intel : Core 2 Extreme ~ 3.2 GHz (775 Dual-core)
Core 2 Quad ~ 2.66 GHz (775 Quad-core)
LGA775 ~ 3.73 GHz (Prescott)

Thermal resistance 5M/s Flow Speed 0.28¡ã °C/W
Thermal type Stars-420 white grease(Injection Tube,0.5g)

*All Spire CPU cooling products come with thermal compound either pre-applied onto the cooler or in an injection tube. Compound will begin to function at its optimum potential, after a gradual increase in heat-dissipation, approximately 168 hours (7days) after initial application.