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SKU:13125343
The DB1 is an ultra-compact fanless ITX case, designed to be paired with the new generation of APU/IGPUs, that is both competitively priced and built without any sacrifice on design or quality.
With a total volume less than 5l, the DB1 is our most compact fanless case but can still comfortably handle 45W of cooling, which is ideal for power-efficient systems based, especially when combined with the new generation of APU/IGPUs that deliver excellent performance/watt.
The DB1 is constructed from 4mm thick aluminium panels, a 21mm thick extruded heat sink, solid aluminium rods and is made using CNC milling and finished with sandblasted/anodised surface treatment, but despite using these premium materials, processing and finishing, is extremely competitively priced.
PRODUCT SPECIFICATIONS:
Form Factor: Ultra Compact Small Form Factor (SFF), mini tower, Mini-ITX motherboard support
Expansion: No support for PCIe expansion
PSU: Nano type PSU (external AC + DC PCB)
Drives: Support for 1 x 2.5" drive and m.2 provided by the motherboard
CPU Cooling: 45W of CPU cooling, 2 x 6mm Heat Pipes
Dimensions: 222 x 222 x 101mm (D x H x W)
Weight: 1.9kg NET 2.5kg GROSS (packed weight)
Ports: Included USB Type-A 3.0 (Optional Type-C 3.1 Gen2)
Material: Aluminium 6063 for heat sink, side, front and back panels, acrylic upper and lower panels
Finish: Sandblast and anodized surface treatment, available in black and silver
VERSATILE AND MODULAR
ULTRA COMPACT DESIGN
It’s hard to appreciate just how small and tightly packed some our compact cases are, to the extent that we sometimes get asked if it’s possible to install an SFX or even ATX PSU inside them. For some context, the DB1 is not much larger than the ITX motherboard it holds, and this ultra small form factor is only made possible by the use of a NanoPSU that plugs directly into the motherboard.
DESIGN SIMPLICITY AND MODULARITY
It's hard to overstate just how simple and ingenious the design is. The entire case can be disassembled with just 4 screws making installation of the motherboard and CPU cooler easier. As the case is symmetrical, the panels can be rearranged to the front I/O is modular meaning it can be replaced with an alternative port.
